The ZSSC3230  is a CMOS integrated circuit for accurate capacitance-to-digital conversion and sensor-specific correction of capacitive sensor signals. Digital compensation of sensor offset, sensitivity, and temperature drift is accomplished via an internal digital signal processor running a correction algorithm with calibration coefficients stored in a non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3230 is simple via the serial interface. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The ZSSC3230 is configurable for capacitive sensors with capacitances up to 30pF and will provide a scalable up to 18 bit output resolution. It is compatible with single ended capacitive sensors. Measured and corrected sensor values can be output as I2C™ (≤ 3.4MHz).

The ZSSC3230 provides accelerated signal processing, increased resolution, and improved noise immunity in order to support high-speed control, safety, and real-time sensing applications with highest requirements for energy efficiency.

Features

  • Supply Voltage 1.68–3.6V 
  • Low current consumption with 1.3µA at 1 sample per second
  • Maximum target input capacitance: 30pF
  • Programmable capacitance span and offset
  • High sampling rate with 430Hz at 14-bit resolution
  • ADC resolution: adjustable in speed and resolution, 18-bit in maximum
  • Internal auto-compensated temperature sensor, not stress sensitive
  • Programmable measurement sequence, single shot and automatic cycling of measurements with end-of-sequence interrupt output
  • Oversampling modes by internal averaging
  • Interrupt features
  • Build in NVM for configuration and free space for arbitrary user data
  • Small die size
  • External reset pin (low active)
  • No external trimming components required
  • Highly integrated CMOS design
  • Package: Die and 24-VFQFPN

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Range Carrier Type Buy Sample
ZSSC3230BC1B Preview DICE WAFER 0 -40 to 85°C Wafer
Availability
ZSSC3230BC2B Preview DICE WAFER 0 -40 to 85°C Wafer
Availability
ZSSC3230BC3R Preview NLG24 VFQFPN 24 0 to 70°C Reel
Availability
ZSSC3230BC5B Preview DICE WAFER 0 -40 to 85°C Wafer
Availability
ZSSC3230BC6B Preview DICE WAFER 0 -40 to 85°C Wafer
Availability
ZSSC3230BI1B Preview DICE WAFER 0 -40 to 125°C Wafer
Availability
ZSSC3230BI1DES Preview DICEW WAFER 0 -40 to 125°C WFP
Availability
ZSSC3230BI2B Preview DICE WAFER 0 -40 to 85°C Wafer
Availability
ZSSC3230BI3R Preview NLG24 VFQFPN 24 -40 to 125°C Reel
Availability
ZSSC3230BI3W Preview NLG24 VFQFPN 24 -40 to 125°C Reel
Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
ZSSC3230 Datasheet Datasheet PDF 982 KB
User Guides & Manuals
ZSSC3230 Calibration Guide Guide PDF 815 KB
ZSSC3230 Evaluation Kit Manual Manual - Eval Board PDF 3.18 MB
Choosing the Right Sensor Signal Conditioning IC Guide PDF 300 KB
IDT CAD Altium Libraries for AID Products Rev 20160819 Guide ZIP 1.20 MB
Application Notes & White Papers
IDT Wafer Dicing Guidelines Application Note PDF 44 KB
Other
Sensing Technologies and Sensor Solutions Overview 简体中文 Overview PDF 2.57 MB
ZSSC3230 Technical Brief - Die and Wafer Information Technical Brief PDF 528 KB
Sensor Signal Conditioning ICs for Industrial and Consumer Applications 日本語 Overview PDF 6.88 MB

Software & Tools

Title Other Languages Type Format File Size Date
ZSSC323x Evaluation Software Rev. 1.3.15 Software ZIP 3.79 MB

Evaluation Boards

Part Number Title Sort ascending
ZSSC3230KIT Evaluation Kit for ZSSC3230