The QS3VH16861 HotSwitch with 20-bit flow-though pin out is a high bandwidth bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH16861 ideal for high performance communications applications. The QS3VH16861 operates from -40C to +85C.

特長

  • N channel FET switches with no parasitic diode to Vcc
  • Isolation under power-off conditions
  • No DC path to Vcc or GND
  • 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Low RON - 4 ohm typical
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • Vcc operation: 2.3V to 3.6V
  • High bandwidth - up to 500 MHz
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • Available in 48 pin TSSOP package

製品選択

発注型名 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type 購入/サンプル
Active TSSOP 48 C はい Tube
Availability
Active TSSOP 48 C はい Reel
Availability

ドキュメント&ダウンロード

タイトル 他の言語 分類 形式 サイズ 日付
データシート
QS3VH16861 Datasheet データシート PDF 343 KB
PCN / PDN
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly 製品変更通知 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly 製品変更通知 PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location 製品変更通知 PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location 製品変更通知 PDF 544 KB
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages 製品変更通知 PDF 333 KB
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages 製品変更通知 PDF 291 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 製品変更通知 PDF 24 KB
PCN# : A0803-02 Add ATP as alternate assembly for TSSOP-48 and TSSOP-56 製品変更通知 PDF 129 KB
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed 製品変更通知 PDF 201 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 製品変更通知 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph 製品変更通知 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 製品変更通知 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 製品変更通知 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 製品変更通知 PDF 35 KB
PDN# L-05-04 Selective Logic Products Obsolescence 製品中止通知 PDF 173 KB
PCN#: A-0405-06, To qualify alternate facility ATP for PV (SSOP) 製品変更通知 PDF 22 KB
PCN#:A-0312-01, new mold compound material - G600 製品変更通知 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 製品変更通知 PDF 116 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer 製品変更通知 PDF 110 KB
PCN# G-0110-06 REV.1 Mold Compound 製品変更通知 PDF 48 KB
PCN# G-0203-05 Mold Compound 製品変更通知 PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 製品変更通知 PDF 27 KB
PCN# G-0110-06 Mold Compound 製品変更通知 PDF 47 KB
PCN# L0110-04 Moisture Level Change From 1 to 3 製品変更通知 PDF 32 KB
Downloads
QS3VH16861 IBIS Model モデル-IBIS ZIP 9 KB
QS3VH16861 Hspice Model モデル-HSPICE ZIP 24 KB