The QS3125 provides a set of four high-speed low resistance CMOS switches connecting inputs to outputs without propagation delay and without generating additional ground bounce noise. The QS3125 is ideal for signal and control switching since the device adds no noise, ground bounce, propagation delay, or significant power consumption to the system. The QS3125 can also be used for analog switching applications such as video. The QS3125 operates at -40C to +85C.

Features

  • Enhanced N channel FET with no inherent diode to Vcc
  • Pin compatible with the 74'125 function
  • Undershoot clamp diodes on all switch and control inputs
  • Hot-swapping, hot-docking
  • Voltage translation (5V to 3.3V)
  • Power conservation
  • Capacitance reduction and isolation (mass storage, work stations)
  • Logic replacement (data processing)
  • Clock gating
  • Bus isolation
  • Available in 16 pin QSOP and 14 pin SOIC packages

Product Options

注文可能な製品ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type 購入/サンプル
QS3125QG Active PCG16 QSOP 16 C Yes Tube
Availability
QS3125QG8 Active PCG16 QSOP 16 C Yes Reel
Availability
QS3125S1G Active DCG14 SOIC 14 C Yes Tube
Availability
QS3125S1G8 Active DCG14 SOIC 14 C Yes Reel
Availability

Documentation & Downloads

タイトル 他の言語 タイプ 形式 サイズ 日付
データシート
QS3125 Datasheet Datasheet PDF 40 KB
アプリケーションノート、ホワイトペーパー
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 417 KB
Quickswitch Basics Application Note PDF 142 KB
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB
AN-19: Space Reduction Via Placement Application Note PDF 41 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB
PCN / PDN
PCN# : A1905-01 Alternate Assembly Location & Change of Material Sets Product Change Notice PDF 313 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB
Downloads
QS3125 IBIS Model Model - IBIS ZIP 4 KB
QS3125 Hspice Model Model - HSPICE ZIP 6 KB

Boards & Kits