The 74FCT163244 16-bit high-speed, low-power buffer/line drivers offer bus/ backplane interface capability with improved packing density. The three-state controls operate these devices in a Quad-Nibble, Dual-Byte or single 16-bit word mode. The inputs can be driven from either 3.3V or 5V devices allowing the use of these devices as translators in a mixed 3.3V/5V supply system. Thus, the 74FCT163244 can be used as buffers to connect 5V components to a 3.3V bus. The 74FCT163244 operates at -40C to +85C

特長

  • A and C speeds
  • Typical tSK(o) (Output Skew) < 250ps
  • ESD > 2000V per MIL-STD-883, Method 3015
  • > 200V using machine model (C = 200pF, R = 0)
  • VCC = 3.3V ± 0.3V, Normal Range, or VCC = 2.7V to 3.6V, Extended Range
  • CMOS power levels (0.4 uW typ. static)
  • Rail-to-rail output swing for increased noise margin
  • Low Ground Bounce (0.3V typ.)
  • Inputs (except I/O) can be driven by 3.3V or 5V components
  • Available in 48 pin SSOP, TSSOP, and TVSOP packages

製品選択

発注型名 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type パッケージ 購入/サンプル
74FCT163244APAG Active TSSOP 48 C はい Tube Package Info
Availability
74FCT163244APAG8 Active TSSOP 48 C はい Reel Package Info
Availability
74FCT163244APFG Active TVSOP 48 C はい Tube Package Info
Availability
74FCT163244APFG8 Active TVSOP 48 C はい Reel Package Info
Availability
74FCT163244APVG Active SSOP 48 C はい Tube Package Info
Availability
74FCT163244APVG8 Active SSOP 48 C はい Reel Package Info
Availability
74FCT163244CPAG Active TSSOP 48 C はい Tube Package Info
Availability
74FCT163244CPAG8 Active TSSOP 48 C はい Reel Package Info
Availability
74FCT163244CPFG Active TVSOP 48 C はい Tube Package Info
Availability
74FCT163244CPFG8 Active TVSOP 48 C はい Reel Package Info
Availability
74FCT163244CPVG Active SSOP 48 C はい Tube Package Info
Availability
74FCT163244CPVG8 Active SSOP 48 C はい Reel Package Info
Availability

ドキュメント&ダウンロード

タイトル 他の言語 分類 形式 サイズ 日付
データシート
74FCT163244 Datasheet Datasheet PDF 132 KB
アプリケーションノート、ホワイトペーパー
AN-116: Decoupling Double Density Components Application Note PDF 96 KB
AN-124: 3.3V Logic Characteristics Application Note PDF 172 KB
AN-124: 3.3V Logic Characteristics Application Note PDF 172 KB
PCN / PDN
PCN# : A2001-01 OSET, Taiwan will be Transferred to UTL, Thailand Product Change Notice PDF 151 KB
PCN# : A1908-02 Adding SPEL India and Greatek Taiwan as Qualified Assembly Facilities Product Change Notice PDF 157 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB
PCN# : A1506-02 Gold wire to Copper wire Product Change Notice PDF 35 KB
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB
PCN# : A1504-04 Assembly Transfer from Amkor Philippines to OSE Taiwan Product Change Notice PDF 484 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# : A0803-02 Add ATP as alternate assembly for TSSOP-48 and TSSOP-56 Product Change Notice PDF 129 KB
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed Product Change Notice PDF 201 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB
PCN#: A-0405-06, To qualify alternate facility ATP for PV (SSOP) Product Change Notice PDF 22 KB
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB
PCN#: G-0303-04, new m/c G700 & 8290 d/a material Product Change Notice PDF 130 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB
PCN# G-0110-06 REV.1 Mold Compound Product Change Notice PDF 48 KB
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB
PCN# G-0110-06 Mold Compound Product Change Notice PDF 47 KB
PCN# L0110-04 Moisture Level Change From 1 to 3 Product Change Notice PDF 32 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
PDN# Logic-00-07: Obsolete Selective Speed Grades Product Delete Notice PDF 14 KB
PCN# L9910-03R1: Die revision, N or L to X Product Change Notice PDF 12 KB
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB
Downloads
74FCT163244 IBIS Model Model - IBIS ZIP 10 KB
74FCT163244 Hspice Model Model - HSPICE ZIP 12 KB