The ZSSC3026 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input signal. Designed for high-resolution altimeter module applications, the ZSSC3026 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected bridge values are provided at the digital output pins, which can be configured as I2C (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3026 is simple via the serial interface. The IC-internal charge pump provides the MTP programming voltage. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. Digital mating of the sensor with the signal conditioner is fast and precise, eliminating the overhead normally associated with trimming external components and multi-pass calibration routines.

特長

  • Flexible, programmable analog front-end design, up to 16-bit scalable, charge-balancing two-segment analog-to-digital converter (ADC)
  • Fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor)
  • Internal auto-compensated temperature sensor
  • Digital compensation of individual sensor offset
  • 1st and 2nd order digital compensation of sensor gain
  • Digital compensation of 1st and 2nd order temperature gain and offset drift
  • Intelligent power management unit
  • Layout customized for die-die bonding with sensor for high-density chip-on-board assembly
  • Typical sensor elements can achieve accuracy of less than ±0.10% FSO @ -40 to 110 °C

製品選択

発注型名 Part Status Pkg. Type Lead Count (#) Temp. Range Carrier Type 購入/サンプル
Active WAFER 0 -40 to 85°C Wafer
Availability
Active WAFER 0 -40 to 85°C Wafer
Availability
Active WAFER 0 -40 to 85°C WFP
Availability

ドキュメント&ダウンロード

タイトル 他の言語 分類 形式 サイズ 日付
データシート
ZSSC3026 Short-form Datasheet ショートフォーム(簡略版) PDF 201 KB
ZSSC3026 Datasheet データシート PDF 770 KB
ユーザーガイド
IDT CAD Altium Libraries for AID Products Rev 20160819 ガイド ZIP 1.20 MB
ZSSC30x6 Evaluation Kit Description マニュアル PDF 2.16 MB
アプリケーションノート、ホワイトペーパー
IDT Wafer Dicing Guidelines アプリケーションノート PDF 144 KB
Downloads
ZSSC3026 and ZSSC3036 Evaluation Kit Software Rev. 3.1_3026_3036 ソフトウェア ZIP 8.10 MB
その他資料
Sensing Technologies and Sensor Solutions Overview 简体中文 概要 PDF 1.96 MB
Choosing the Right Sensor Signal Conditioning IC その他 PDF 300 KB
Sensor Signal Conditioning ICs for Industrial and Consumer Applications (Japanese) English 概要 PDF 767 KB