文档标题 信息
Package Description SOIC 4.90x3.90x1.50 mm 1.27mm Pitch
Package Status Active
Package Type SOIC
类别 PLASTIC
Package Code DCG8
分类 G
Lead Count 8
Pb (Lead) Free Yes
长度 4.9mm
Pb Free Category e3 Sn
宽度 3.9mm
Thickness 1.5mm
Peak Reflow Temp 260.00°C
Pitch 1.27mm
Package Carrier Reel, Tube
Pkg. Dimensions (mm) 4.9 x 3.9 x 1.5

Documentation

文档标题 他の言語 文档类型 文档格式 文件大小
PCN / PDN
DCG8 Copper Wire IPC 1752-1 V1.01 Class 6 (MCD) Product Change Notice PDF 332 KB
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notification PDF 147 KB
其它
Recommended Reflow Profile Product/Marketing PDF 135 KB
DCG8 Package Outline Drawing 0.150" Body Width 0.050" Pitch SOIC Package Outline Drawing PDF 185 KB
DC/DCG8 PACKAGE OUTLINE (DC OR S1 TOPMARK CODE) (DC OR S1 TOPMARK CODE) .050" PITCH Package Outline Drawing PDF 84 KB
8-SOIC Package Outline Drawing
0.150" Body Width, 0.050" Pitch
DCG8D1
Package Outline Drawing PDF 131 KB
Green Products RoHS Material Declaration Certificate Certificate PDF 170 KB
13" PLASTIC REEL WITH 4" HUB Carrier / Package Type PDF 53 KB
COVER TAPE Carrier / Package Type PDF 28 KB
DCG8 PACKAGE OUTLINE 150 mil SOP Package Outline Drawing PDF 34 KB
DC/DCG, DJ/DJG, DM/DMG, EX/EXG 8 & PC/PCG SHIPPING TUBE Carrier / Package Type PDF 25 KB
DC/DCG 8, EX/EXG 8 & PC/PCG 16 CARRIER TAPE Carrier / Package Type PDF 28 KB
DCG8 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 361 KB
DC/DCG8/14/16 PACKAGE OUTLINE (DC OR S1 TOPMARK CODE) .150" BODY WIDTH SOIC .050" PITCH Carrier / Package Type PDF 126 KB
DCG8 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 516 KB
DCG8 Copper Wire IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 516 KB