The ZSSC3224 is a sensor signal conditioner (SSC) IC for high-accuracy amplification and analog-to digital conversion of a differential or pseudo-differential input signal. Designed for high-resolution sensor module applications, the ZSSC3224 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge or absolute voltage sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected sensor values are provided at the digital output pins, which can be configured as I2C (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via a 26-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3224 is simple via the serial interface. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The ZSSC3224 provides accelerated signal processing, increased resolution, and improved noise immunity in order to support high-speed control, safety, and real-time sensing applications with the highest requirements for energy efficiency.

特性

  • Flexible, programmable analog front-end design,up to 24-bit analog-to-digital converter (ADC)
  • Fully programmable gain amplifier for optimizing sensor signals: gain range 6.6 to 216 (linear)
  • Internal auto-compensated 18-bit temperature sensor
  • Digital compensation of individual sensor offset
  • 1st and 2nd order digital compensation of sensor gain as well as 1st and 2nd order temperature gain and offset drift
  • Programmable interrupt operation
  • High-speed sensing: e.g., 18-bit conditioned sensor signal measurement rate >200s-1
  • Typical sensor elements can achieve an accuracy of better than ±0.10% full-scale output at -40 to 85°C

产品选择

下单器件 ID Part Status Description Pkg. Type Lead Count (#) Temp. Range Carrier Type 封装 Buy Sample
ZSSC3224BI1B Active 304μm thickness WAFER 0 -40 to 85°C Wafer Package Info
Availability
ZSSC3224BI2B Active 725μm thickness WAFER 0 -40 to 85°C Wafer Package Info
Availability
ZSSC3224BI3R Active VFQFPN 24 -40 to 85°C Reel Package Info
Availability

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
数据手册与勘误表
ZSSC3224 Datasheet Datasheet PDF 1.06 MB
ZSSC3224 Short-form Datasheet Short Form Datasheet PDF 245 KB
使用指南与说明
ZSSC3224-KIT Evaluation Kit Description Manual PDF 4.14 MB
应用指南 &白皮书
IDT Wafer Dicing Guidelines Application Note PDF 144 KB
Downloads
ZSSC3224 Evaluation Kit Software Rev. 1.1 Software ZIP 8.09 MB
其他
Sensing Technologies and Sensor Solutions Overview (Chinese) English Overview PDF 1.64 MB
Sensing Technologies and Sensor Solutions Overview (Chinese) English Overview PDF 1.64 MB
Choosing the Right Sensor Signal Conditioning IC Miscellaneous PDF 300 KB
Sensor Signal Conditioning ICs for Industrial and Consumer Applications 日本語 Overview PDF 2.93 MB