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| IDT PCI Express Switching Solutions |
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View Product Selection Table Below
IDT provides the industry’s broadest and most comprehensive family of PCI Express switching solutions. Through extensive collaboration with leading customers, IDT offers solutions optimized to maximize performance per watt for the most demanding server, storage, communications, embedded and consumer applications. With switching solutions optimized for System Interconnect and I/O Expansion, IDT is the right choice!
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IDT System Interconnect Solutions
IDT introduced the industry’s first PCI Express Gen1 and Gen2 system interconnect solutions. Consisting of a broad family of configurations for control, data and services plane traffic, the solutions provide deterministic, non-blocking, line rate performance and advanced support for inter-processor communications and peripheral sharing in bladed and large-scale embedded applications.
- Delivers high performance and scalability
- Industry’s first 64-lane devices offer 64GBps (Gen2)
and 32GBps (Gen1) capacity
- Industry’s first 16-port device increases system scalability
- Enables flexible system scaling and optimal resource utilization
- Multi-root support through partitionable switch architecture
- Dynamic I/O allocation and sharing
- Flexible I/O mapping
- Ensures high RAS and security
- Advanced multi-host failover
- End point security and isolation
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IDT I/O Expansion Switching Solutions
The IDT family of PCIe switches for I/O expansion is the broadest, most targeted set of solutions aimed at providing high-performance "aggregation" or "fan-out" switching to fill the connectivity gap created by north bridge devices with limited high performance I/O expansion. The family offers the most comprehensive set of solutions with configurations ranging from 3 to 48 lanes and 3 to 12 ports.
- Delivers high performance and scalability
- Industry’s first Gen2 switches
- Industry’s first 12-port switch
- Cut-through switching architecture for low system latency
- Support for a large number of flow control credits
- 2 Kbyte maximum payload size (MPS)
- Simplifies thermal management
- Lower power, 20% to 50% lower than competitive offerings
- Reduces or eliminates heat sinks, air flow requirements
- Saves board space
- Small footprint, up to 40% smaller than competitive offerings
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Part Number
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Lanes
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Ports
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PCIe Generation
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PCIe Revision
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Package
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| System Interconnect Switches |
| 89HPES16H16 |
16
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16
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Gen1
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1.1
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23 mm x 23 mm, 484-ball BGA
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| 89HPES22H16 |
22
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16
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Gen1
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1.1
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23 mm x 23 mm, 484-ball BGA
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| 89HPES22H16G2 |
22
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16
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Gen 2
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2.0
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35 mm x 35 mm, 1156-ball BGA
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| 89HPES32H8 |
32
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8
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Gen1
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1.1
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31 mm x 31 mm, 900-ball BGA
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| 89HPES32H8G2 |
32
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8
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Gen 2
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2.0
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23 mm x 23 mm, 484-ball BGA
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| 89HPES34H16 |
34
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16
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Gen1
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1.1
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35 mm x 35 mm, 1156-ball BGA
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| 89HPES34H16G2 |
34
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16
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Gen 2
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2.0
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35 mm x 35 mm, 1156-ball BGA
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| 89HPES48H12 |
48
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12
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Gen1
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1.1
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35 mm x 35 mm, 1156-ball BGA
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| 89HPES48H12G2 |
48
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12
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Gen 2
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2.0
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27 mm x 27 mm, 676-ball BGA
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| 89HPES48H12AG2 |
48
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12
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Gen 2
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2.0
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35 mm x 35 mm, 1156-ball BGA
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| 89HPES64H16 |
64
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16
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Gen1
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1.1
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35 mm x 35 mm, 1156-ball BGA
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| 89HPES64H16G2 |
64
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16
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Gen 2
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2.0
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35 mm x 35 mm, 1156-ball BGA
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| 89HPES64H16AG2 |
64
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16
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Gen 2
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2.0
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35 mm x 35 mm, 1156-ball BGA
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| Inter-Domain Switches |
| 89HPES8NT2 |
8
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2
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Gen1
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1.0a
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19 mm x 19 mm, 324-ball BGA
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| 89HPES12NT3 |
12
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3
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Gen1
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1.0a
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19 mm x 19 mm, 324-ball BGA
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| 89HPES16NT2 |
16
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2
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Gen1
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1.0a
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23 mm x 23 mm, 484-ball BGA
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| 89HPES24NT3 |
24
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3
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Gen1
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1.0a
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27 mm x 27 mm, 420-ball BGA
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| I/O Expansion Switches |
| 89HPES3T3 |
3
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3
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Gen1
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1.1
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10 mm x 10 mm, 132-lead QFN
13 mm x 13 mm, 144-ball BGA
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| 89HPES4T4 |
4
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4
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Gen1
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1.1
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10 mm x 10 mm, 132-lead QFN
13 mm x 13 mm, 144-ball BGA
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| 89HPES4T4G2 |
4
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4
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Gen 2
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2.0
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19 mm x 19 mm, 324-ball BGA
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| 89HPES5T5 |
5
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5
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Gen1
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1.1
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15 mm x 15 mm, 196-ball BGA
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| 89HPES6T5 |
6
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5
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Gen1
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1.1
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15 mm x 15 mm, 196-ball BGA
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| 89HPES6T6G2 |
6
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6
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Gen 2
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2.0
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19 mm x 19 mm, 324-ball BGA
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| 89HPES8T5A |
8
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5
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Gen1
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1.1
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15 mm x 15 mm, 196-balll BGA
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| 89HPES10T4BG2 |
10
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4
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Gen2
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2.0
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19 mm x 19 mm, 324-ball BGA
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| 89HPES12N3A |
12
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3
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Gen1
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1.1
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19 mm x 19 mm, 324-ball BGA
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| 89HPES12T3G2 |
12
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3
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Gen2
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2.0
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19 mm x 19 mm, 324-ball BGA
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| 89HPES12T3BG2 |
12
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3
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Gen2
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2.0
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19 mm x 19 mm, 324-ball BGA
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| 89HPES16T4 |
16
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4
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Gen1
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1.1
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23 mm x 23 mm, 484-ball BGA
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| 89HPES16T4AG2 |
16
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4
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Gen2
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2.0
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19 mm x 19 mm, 324-ball BGA
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| 89HPES16T4BG2 |
16
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4
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Gen2
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2.0
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23 mm x 23 mm, 288-ball BGA
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| 89HPES16T4G2 |
16
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4
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Gen2
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2.0
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23 mm x 23 mm, 288-ball BGA
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| 89HPES16T7 |
16
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7
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Gen1
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1.1
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25 mm x 25 mm, 320-ball BGA
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| 89HPES24N3A |
24
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3
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Gen1
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1.1
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27 mm x 27 mm, 420-ball BGA
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| 89HPES24T3G2 |
24
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3
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Gen2
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2.0
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19 mm x 19 mm, 324-ball BGA
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| 89HPES24T6 |
24
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6
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Gen1
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1.1
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27 mm x 27 mm, 420-ball BGA
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| 89HPES24T6G2 |
24
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6
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Gen2
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2.0
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19 mm x 19 mm, 324-ball BGA
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| 89HPES32T8 |
32
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8
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Gen1
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1.1
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31 mm x 31 mm, 500-ball BGA
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| 89HPES32T8G2 |
32
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8
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Gen 2
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2.0
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23 mm x 23 mm, 484-ball BGA
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| 89HPES48T12 |
48
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12
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Gen1
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1.1
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35 mm x 35 mm, 1156-ball BGA
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| 89HPES48T12G2 |
48
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12
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Gen 2
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2.0
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27 mm x 27 mm, 676-ball BGA
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NOTE: New parts as of July 6, 2009 are listed in red text above. Orderable part numbers may be different than the part numbers shown above. Please consult with your local IDT sales representative if you have any questions.
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Additional Product Information
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PCI Express product page
PCI Express technical product information
PCI Express Switching Solutions Flyer (PDF, Dec. 2008 )
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| About PCI Express |
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PCI Express is an industry-standard, high-performance, general-purpose serial I/O chip-to-chip and board-to-board interconnect providing a cost-effective, low-pin count interface offering maximum bandwidth per pin. Key features of the standard include:
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