For Immediate Release
For Further Information:
Caroline Phillips, Corporate
Communications Manager (408) 492-8620
Steve Eliscu, Subsystems Marketing
Manager (408) 456-2315
SANTA CLARA, Calif., August 21, 1996
–Integrated Device Technology, Inc. (IDT), the world's largest
level 2 (L2) cache module supplier, introduced today the first L2 cache
memory module and a new industry standard for the mobile computing industry.
The IDT7MPV6271, a 256KB pipelined burst secondary cache module, is
designed for use with all major mobile chipsets including those from
Intel, OPTi, VLSI, Cirrus and ACC Micro, and gives designers the ability
to build a motherboard with the most optimized use of space and with
the maximum flexibility for different.
"For many years, designers of desktop
PCs have recognized the benefits of using an L2 cache module in their
designs to boost performance, optimize the use of board space, reduce
inventory and carrying costs, and offer users the flexibility to upgrade
to larger caches," said Steve Eliscu, IDT's subsystems marketing manager.
"With this new cache solution, IDT brings these same benefits to the
world of mobile computing."
Mobile Cache Module Optimizes Space Through Unique Design
In any mobile system, the key issue
facing designers is optimizing a limited amount of space. IDT has developed
the IDT7MPV6271 in conjunction with an industry leading mobile PC manufacturer
to allow today's and upcoming Pentium(r) CPU-based mobile computers
to reap the benefits that a module solution offers. To optimize the
use of space, this module takes advantage of the new right angle 144-pin
surface mount small-outline dual in-line memory module (SO-DIMM) socket.
This socket, which allows components to be mounted on the motherboard
directly underneath the area already occupied by the module, uses only
slightly more space than a single 32K x 32 pipelined burst SRAM. Standing
at a maximum height of only 150 mils off the motherboard, the module
utilizes the same vertical space in the system already allocated for
DRAM upgrades.
"Designers can increase performance
by 20 percent by adding L2 cache to a system, giving them the incentive
to offer end users the cache option. The socket and module approach
will enable OEMs to have the same flexbility offered by modules in mobile
systems as they have had in desktop systems," added Eliscu. "And, as
Pentium notebooks become more of a commodity, OEMs will be able to easily
respond to market pressures to reduce costs by making the cache optional
for entry-level systems. In addition, for high-end systems, OEMs can
offer 256KB as a standard on the motherboard and use the module to upgrade
the cache size to 512KB."
The IDT7MPV6271 operates with Pentium
processor external bus speeds of up to 66MHz. The module's TTL-compatible
inputs and outputs operate from a single 3.3-volt power supply, and
it utilizes two of IDT's 71V432 32K x 32 pipelined burst SRAMs in thin
quad flat packages (TQFP) and one 3.3-volt IDT71V256 32K x 8 SRAM in
a thin small outline package (TSOP), all on a single 144-lead module.
In the second half of 1996, IDT plans to introduce a 512KB version of
the IDT7MPV6271 as well as versions based on its Fusion Memory(tm) technology.
Pricing, Packaging and Availability
Both speed grades of the IDT7MPV6721
are available now in volume production. Pricing for 1,000-piece quantities
starts at $37.00 each for the 12ns tag version and $36.00 each for the
15ns tag version.
Electronic Media Program
Information about IDT and its products
is easily accessible through IDT's comprehensive electronic media program,
which includes free CD-ROMs by calling (800) 345-7015, a Home Page on
the World Wide Web ( http://www.idt.com),
and fax-on-demand services by calling (800) 9-IDT-FAX. For more information
about these services, call (800) 345-7015. About IDT
Integrated Device Technology, Inc. (IDT)
designs, manufactures, and markets high-performance integrated circuits
and modules that are used in products in four rapidly growing market
segments: communications equipment, such as routers, hubs, switches,
cellular base stations, and other devices; distributed computing systems,
such as workstations and servers; personal computers (PCs), desktop
and notebook; and office automation equipment, such as laser printers
and color copiers. IDT enhances the opportunity of its customers to
optimize the cost and performance of their microprocessor-based systems
by providing innovative solutions based on four product areas: high-speed
SRAMs
and Fusion Memory(tm); communications products, including industry-leading
FIFO
memories, multi-port memories, and Asynchronous Transfer Mode ( ATM)
products; RISC
microprocessors, optimized for both embedded as well as reprogrammable
applications; and high-performance logic.
Headquartered in Santa Clara, Calif., IDT employs approximately 3,960
people worldwide. This press release contains forward-looking
statements. Actual results may differ materially from those stated depending
on a number of factors, including but not limited to product supply
and demand, order cancellations, pricing, competition and manufacturing
yields, particularly as they affect SRAM products and the Company's
ability to obtain and fill orders from inventory during the balance
of the quarter. Please read the section titled, "Factors Affecting Future
Results" in the Company's most recent Form 10Q on file with the Securities
and Exchange Commission.
* * *
Trademark notice:
Fusion Memory is a trademark of Integrated Device Technology.
Pentium is a registered trademark of Intel Corporation.
|
