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BF96 (CABGA 96)

Package Description

CHIP ARRAY BGA 5.5 X 13.5 MM X 0.8 MM PI

Package Status

Active

Package Type

CABGA

Class

PLASTIC

Package Code

BF96

Category

240

Lead Count

96

Pb (Lead) Free

No

Length

13.5mm

Pb Free Category

e0

Width

5.5mm

Thickness

1.4mm

Peak Reflow Temp

225°C

Pitch

0.8mm

Pkg. Dimensions

13.5 x 5.5 x 1.4

Documents

Title Typesort icon Format File Size Date
BF/BFG 96 CARRIER TAPE Carrier / Package Type PDF 27 KB Mar 11, 2016
BF/BFG 96 SHIPPING TRAY Carrier / Package Type PDF 158 KB Jan 3, 2016
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 137 KB Sep 10, 2015
BF96 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 526 KB Feb 14, 2008
BF96 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 287 KB Aug 8, 2010
BF/BFG PACKAGE OUTLINE 5.50 mm BODY WIDTH .80 mm BALL PITCH FPBGA Package Outline Drawing PDF 300 KB Jun 24, 2013
PCN# A-0607-05 Green Mold Compound KMC3580 for BGA Product Change Notification PDF 194 KB Aug 30, 2006
PCN# : A-0610-02 ASAT China as Alternate Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP Product Change Notification PDF 252 KB Oct 19, 2006
PCN# A-0601-01 AIT as Alternate Assembly Location Product Change Notification PDF 281 KB Mar 21, 2006
PCN# : A-0607-02 IDT Penang as Alternate Assembly Facility for ICS CVBGA and FPBGA Product Change Notification PDF 101 KB Jul 27, 2006
PCN# : A-0610-01 Transfer of IDT Penang Assembly to AIT Product Change Notification PDF 174 KB Oct 9, 2006
PCN# : A0704-02 New Die Attach Material for CABGA-256, FPBGA-96/208, CVBGA-52/56, PBGA-119/272/416 Product Change Notification PDF 177 KB Sep 18, 2007
IDT User Recommended Reflow Profile (Standard 225C) Reflow Profile PDF 94 KB Jan 31, 2008