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BFG208 (CABGA 208)

Package Description

CHIP ARRAY BGA 15.0 X 15.0 MM X 0.8 MM P

Package Status

Active

Package Type

CABGA

Class

PLASTIC

Package Code

BFG208

Category

G

Lead Count

208

Pb (Lead) Free

Yes

Length

15mm

Pb Free Category

e1 SnAgCu

Width

15mm

Thickness

1.4mm

Peak Reflow Temp

260°C

Pitch

0.8mm

Pkg. Dimensions

15 x 15 x 1.4

Documents

Title Typesort icon Format File Size Date
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 137 KB Sep 10, 2015
BC/BCG 196 & BF/BFG 208/289 SHIPPING TRAY Carrier / Package Type PDF 105 KB May 22, 2016
Green Products RoHS Material Declaration Certificate Certificates / Reports PDF 95 KB Mar 11, 2013
BFG208 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 258 KB Aug 26, 2009
BFG208 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB Aug 26, 2009
BF/BFG PACKAGE OUTLINE 15.0 X 15.0 MM BODY FPBGA Package Outline Drawing PDF 196 KB Jun 12, 2013
PCN# : A0704-02 New Die Attach Material for CABGA-256, FPBGA-96/208, CVBGA-52/56, PBGA-119/272/416 Product Change Notification PDF 177 KB Sep 18, 2007
PCN# A-0607-05 Green Mold Compound KMC3580 for BGA Product Change Notification PDF 194 KB Aug 30, 2006
PCN# : A-0610-02 ASAT China as Alternate Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP Product Change Notification PDF 252 KB Oct 19, 2006
PCN# A-0601-01 AIT as Alternate Assembly Location Product Change Notification PDF 281 KB Mar 21, 2006
IDT User Recommended Reflow Profile (Pb-Free 260C) Reflow Profile PDF 85 KB Jan 31, 2008