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BLG400 (FCBGA 400)

Package Description

FLIP CHIP BGA 21X21 MM X 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

BLG400

Category

G

Lead Count

400

Pb (Lead) Free

Yes

Length

21mm

Pb Free Category

e1 SnAgCu

Width

21mm

Thickness

2.75mm

Peak Reflow Temp

245°C

Pitch

1mm

Pkg. Dimensions

21 x 21 x 2.75

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