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HMH675 (FCBGA 675)

Package Description

FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

HMH675

Category

RoHS

Lead Count

675

Pb (Lead) Free

No

Length

27mm

Pb Free Category

e0

Width

27mm

Thickness

2.41mm

Peak Reflow Temp

245°C

Pitch

1mm

Pkg. Dimensions

27 x 27 x 2.41

Documents

Title Typesort icon Format File Size Date
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015