HMH675 (FCBGA 675)

Title Information
Package Description FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH
Package Status Active
Package Type FCBGA
Class PLASTIC
Package Code HMH675
Category RoHS
Lead Count 675
Pb (Lead) Free No
Length 27mm
Pb Free Category e0
Width 27mm
Thickness 2.4mm
Peak Reflow Temp 245.00°C
Pitch 1.0mm
Package Non-Reel Carrier TRAY
Pkg. Dimensions 27 x 27 x 2.41

Documentation