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RM784 (FCBGA 784)

Package Description

FLIP CHIP BGA 29 X 29 MM 1.0 MM PITCH

Package Status

Active

Package Type

FCBGA

Class

PLASTIC

Package Code

RM784

Category

RoHS

Lead Count

784

Pb (Lead) Free

No

Length

29mm

Pb Free Category

e1 SnAgCu

Width

29mm

Thickness

2.75mm

Peak Reflow Temp

250°C

Pitch

1mm

Pkg. Dimensions

29 x 29 x 2.75

Documents

Title Typesort icon Format File Size Date
AL/ALG 784, BL/BLG/BR 784 & HM/HMG/HMH/RM 784 CARRIER TAPE Carrier / Package Type PDF 29 KB Feb 20, 2016
COVER TAPE Carrier / Package Type PDF 26 KB Nov 12, 2015
HM/HMG/HMH 784 & RM 784 SHIPPING TRAY Carrier / Package Type PDF 93 KB Oct 5, 2015
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 137 KB Sep 10, 2015
RM784 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB Jan 27, 2011
RM784 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 335 KB Jan 27, 2011
HM/RM 784 PACKAGE OUTLINE 29.0 x 29.0 mm BODY 1.00 mm PITCH die size: 9.82 mm x 10.4 mm Package Outline Drawing PDF 225 KB Jun 18, 2013