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QS3VH257 - Block Diagram

QS3VH257

3.3V Quad 2:1 Mux/Demux for Hot Swap Applications

The QS3VH257 HotSwitch Quad 2:1 multiplexer/demultiplexer is a high bandwidth bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH257 ideal for high performance communication applications. The QS3VH257 operates from -40C to +85C.

Features

  • N channel FET switches with no parasitic diode to VCC
  • Isolation under power-off conditions
  • No DC path to VCC or GND
  • 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Low RON - 4 ohm typical
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • VCC operation: 2.3V to 3.6V
  • High bandwidth - up to 500MHz
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • Available in 16 pin QSOP, SOIC, and TSSOP packages

Product Specification

FunctionPkg. CodeTemp. RangeBus Width (bits)Core Voltage (V)Output TypeOn Resistance (Ω)Speed Grade
4x2:1 Mux/DemuxDCG16, PCG16, PGG16-40 to 85°C83.35Standard

Product Options

Orderable Part IDPart StatusPkg. CodePkg. TypeLead Count (#)Temp. GradePb (Lead) FreeCarrier TypeSample & Buy
QS3VH257PAGActivePGG16TSSOP16IYesTubeCheck Availability
QS3VH257PAG8ActivePGG16TSSOP16IYesReelCheck Availability
QS3VH257QGActivePCG16QSOP16IYesTubeCheck Availability
QS3VH257QG8ActivePCG16QSOP16IYesReelCheck Availability
QS3VH257S1GActiveDCG16SOIC16IYesTubeCheck Availability
QS3VH257S1G8ActiveDCG16SOIC16IYesReelCheck Availability

Documents

Technical Documentation

Title Type Format File Size Datesort icon
Datasheets & Errata
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QS3VH257 Datasheet Datasheet PDF 270 KB Feb 24, 2014
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Errata LEN-08-01 Errata PDF 65 KB Aug 18, 2008
User Guides & Manuals
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FCT Bus Switch Cross Reference Guide Guide PDF 568 KB Aug 10, 2016
Apps Notes & White Papers
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AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB Jun 1, 1996
PCNs & PDNs
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PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Apr 14, 2016
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PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB Feb 15, 2016
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PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB Jan 28, 2016
show all (22)
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PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB Nov 13, 2015
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PCN# : TB1403-01 Changed in Carrier Tape, Plastic Reel and Quantity per Reel on TSSOP-14, TSSOP-16 Product Change Notice PDF 663 KB Apr 8, 2014
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PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 14, 2012
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PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 2, 2005
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PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 22, 2005
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PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 29, 2005
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PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 29, 2005
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PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP Product Change Notice PDF 21 KB Oct 22, 2004
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PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB Jan 19, 2004
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PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 3, 2003
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PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 3, 2003
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PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB Jan 13, 2003
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PCN# L0206-11 ICCQ Max Limit Change Product Change Notice PDF 9 KB Aug 1, 2002
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PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB Apr 16, 2002
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PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB Apr 15, 2002
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PCN# L0108-01R1, Die Revision from YQ, ZQ, QC to Z Product Change Notice PDF 12 KB Dec 10, 2001
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PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 11, 2001
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PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 10, 2000
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PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB Nov 18, 1999

Software & Tools

Title Type Format File Size Datesort icon
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QS3VH257 Hspice Model Model - HSPICE ZIP 18 KB Aug 14, 2001
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QS3VH257 IBIS Model Model - IBIS ZIP 9 KB Dec 8, 2003