3.3V Quad 2:1 Mux/Demux for Hot Swap Applications

The QS3VH257 HotSwitch Quad 2:1 multiplexer/demultiplexer is a high bandwidth bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH257 ideal for high performance communication applications. The QS3VH257 operates from -40C to +85C.

Features

  • N channel FET switches with no parasitic diode to VCC
  • Isolation under power-off conditions
  • No DC path to VCC or GND
  • 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Low RON - 4 ohm typical
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • VCC operation: 2.3V to 3.6V
  • High bandwidth - up to 500MHz
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • Available in 16 pin QSOP, SOIC, and TSSOP packages

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS3VH257PAG Active PGG16 TSSOP 16 I Yes Tube Availability
QS3VH257PAG8 Active PGG16 TSSOP 16 I Yes Reel Availability
QS3VH257QG Active PCG16 QSOP 16 I Yes Tube Availability
QS3VH257QG8 Active PCG16 QSOP 16 I Yes Reel Availability
QS3VH257S1G Active DCG16 SOIC 16 I Yes Tube Availability
QS3VH257S1G8 Active DCG16 SOIC 16 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS3VH257 Datasheet - Datasheet PDF 270 KB Feb 23, 2014
Errata LEN-08-01 - Errata PDF 65 KB Aug 17, 2008
User Guides & Manuals
FCT Bus Switch Cross Reference Guide - Guide PDF 568 KB Aug 9, 2016
Application Notes & White Papers
AN-20: Board Assembly for 0.4mm Pin Surface Mounts - Application Note PDF 62 KB May 31, 1996
PCNs & PDNs
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly - Product Change Notice PDF 611 KB Apr 13, 2016
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly - Product Change Notice PDF 611 KB Feb 14, 2016
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location - Product Change Notice PDF 596 KB Jan 27, 2016
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location - Product Change Notice PDF 544 KB Nov 12, 2015
PCN# : TB1403-01 Changed in Carrier Tape, Plastic Reel and Quantity per Reel on TSSOP-14, TSSOP-16 - Product Change Notice PDF 663 KB Apr 7, 2014
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph - Product Change Notice PDF 16 KB Jul 21, 2005
PCN# G-0203-05 Mold Compound - Product Change Notice PDF 40 KB Apr 15, 2002
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph - Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w - Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green - Product Change Notice PDF 18 KB Sep 1, 2005
PCN# G0106-01, Moisture Sensitive Label Change - Product Change Notice PDF 274 KB Jun 10, 2001
PCN# G0005-01, Laser Top Mark - Product Change Notice PDF 24 KB May 9, 2000
PCN#:A-0401-01, new m/c G600 & 8290 d/a material - Product Change Notice PDF 196 KB Jan 18, 2004
PCN#:A-0312-02, new die attach material - 8290 - Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 - Product Change Notice PDF 109 KB Dec 2, 2003
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP - Product Change Notice PDF 21 KB Oct 21, 2004
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer - Product Change Notice PDF 110 KB Jan 12, 2003
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 - Product Change Notice PDF 27 KB Apr 14, 2002
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT - Product Change Notice PDF 35 KB Apr 28, 2005
PCN# G9911-05, To qualify low alpha mold compound. - Product Change Notice PDF 44 KB Nov 17, 1999
PCN# L0108-01R1, Die Revision from YQ, ZQ, QC to Z - Product Change Notice PDF 12 KB Dec 9, 2001
PCN# L0206-11 ICCQ Max Limit Change - Product Change Notice PDF 9 KB Jul 31, 2002

Software & Tools

Title Other Languages Type Format File Size Date
QS3VH257 Hspice Model - Model - HSPICE ZIP 18 KB Aug 13, 2001
QS3VH257 IBIS Model - Model - IBIS ZIP 9 KB Dec 7, 2003