High-Speed CMOS QuickSwitch Double Width Bus Switch

The QS32X245 provides a set of 16 high-speed CMOS TTL-compatible bus switches in a flow-through pinout. The low ON resistance of the QS32X245 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. QuickSwitch devices provide an order of magnitude faster speed than conventional logic devices. The QS32X245 operates at -40C to +85C.

Features

  • Enhanced N channel FET with no inherent diode to Vcc
  • Dual '245 function
  • 25 ohm resistor for low noise
  • Low propagation delay, zero ground bounce
  • Undershoot clamp diodes on all switch and control inputs
  • TTL-compatible control inputs
  • Available in 40-pin QVSOP package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS32X245Q2G Active DMG40 QVSOP 40 I Yes Tube Availability
QS32X245Q2G8 Active DMG40 QVSOP 40 I Yes Reel Availability

Technical Documentation

Title Other Languages Type Format File Size Date
Datasheets & Errata
QS32X245 Datasheet - Datasheet PDF 211 KB Jul 10, 2012
User Guides & Manuals
FCT Bus Switch Cross Reference Guide - Guide PDF 568 KB Aug 9, 2016
Application Notes & White Papers
AN-11: 5V and 3V Conversion with Zero Delay - Application Note PDF 346 KB Feb 5, 2014
AN-19: Space Reduction Via Placement - Application Note PDF 41 KB May 31, 1996
AN-17: Peripheral Isolation in Notebook Computers - Application Note PDF 68 KB May 31, 1996
AN-09: CMOS Bus Switches Provide 0 Delay - Application Note PDF 121 KB May 31, 1996
AN-13: Converting TTL to Hot Plug - Application Note PDF 85 KB May 31, 1996
AN-20: Board Assembly for 0.4mm Pin Surface Mounts - Application Note PDF 62 KB May 31, 1996
Quickswitch Basics - Application Note PDF 83 KB Jul 5, 2005
TN-07: Analysis of QuickSwitch Behavior - Application Note PDF 102 KB May 31, 1996
PCNs & PDNs
PCN# : A1301-01 Gold to Copper Wire - Product Change Notice PDF 99 KB Jan 27, 2013
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph - Product Change Notice PDF 16 KB Jul 21, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph - Product Change Notice PDF 47 KB Apr 28, 2005
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w - Product Change Notice PDF 24 KB Nov 13, 2012
PCN# A-0508-02: OSET Alternate Assembly Location for Green - Product Change Notice PDF 18 KB Sep 1, 2005
PCN# G0106-01, Moisture Sensitive Label Change - Product Change Notice PDF 274 KB Jun 10, 2001
PCN# G0005-01, Laser Top Mark - Product Change Notice PDF 24 KB May 9, 2000
PCN#:A-0312-02, new die attach material - 8290 - Product Change Notice PDF 116 KB Dec 2, 2003
PCN#:A-0312-01, new mold compound material - G600 - Product Change Notice PDF 109 KB Dec 2, 2003
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer - Product Change Notice PDF 110 KB Jan 12, 2003
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 - Product Change Notice PDF 27 KB Apr 14, 2002
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT - Product Change Notice PDF 35 KB Apr 28, 2005
PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages - Product Change Notice PDF 102 KB May 23, 2006

Software & Tools

Title Other Languages Type Format File Size Date
QS32x245 IBIS Model - Model - IBIS ZIP 4 KB Jan 2, 2001
QS32x245 Hspice Model - Model - HSPICE ZIP 5 KB Nov 1, 2000