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QS32X861 - Block Diagram

QS32X861

QuickSwitch Products High-Speed CMOS 20-Bit Bus switch with Flow-Through Pinout

The QS32X861 provides two sets of ten high-speed CMOS TTLcompatible bus switches. The low ON resistance of the QS32X861 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. The QS32X861 bus switch is ideal for switching digital buses, as well as for hotplug buffering and 5V to 3V conversion. The QS32X861 operates at -40C to +85C.

Features

  • Enhanced N channel FET with no inherent diode to Vcc
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero ground bounce
  • Undershoot clamp diodes on all switch and control inputs
  • Available in 48-pin QVSOP package

Product Specification

FunctionPkg. CodeTemp. RangeBus Width (bits)Core Voltage (V)Output TypeOn Resistance (Ω)Speed Grade
Bus Switch (Flow-through)DJG48-40 to 85°C2055Standard

Product Options

Orderable Part IDPart StatusPkg. CodePkg. TypeLead Count (#)Temp. GradePb (Lead) FreeCarrier TypeSample & Buy
QS32X861Q1GActiveDJG48QVSOP48IYesTubeCheck Availability
QS32X861Q1G8ActiveDJG48QVSOP48IYesReelCheck Availability

Documents

Technical Documentation

Title Type Format File Size Datesort icon
Datasheets & Errata
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QS32X861 Datasheet Datasheet PDF 216 KB Jun 14, 2011
Apps Notes & White Papers
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AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 346 KB Feb 5, 2014
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Quickswitch Basics Application Note PDF 83 KB Jul 6, 2005
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AN-19: Space Reduction Via Placement Application Note PDF 41 KB Jun 1, 1996
show all (8)
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AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB Jun 1, 1996
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AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB Jun 1, 1996
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AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB Jun 1, 1996
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AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB Jun 1, 1996
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TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB Jun 1, 1996
PCNs & PDNs
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PCN# : A1301-01 Gold to Copper Wire Product Change Notice PDF 99 KB Jan 28, 2013
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PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB Nov 14, 2012
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PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages Product Change Notice PDF 102 KB May 24, 2006
show all (13)
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PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB Sep 2, 2005
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PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB Aug 4, 2005
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PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB Jul 22, 2005
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PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB Apr 29, 2005
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PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB Apr 29, 2005
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PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB Dec 3, 2003
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PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB Dec 3, 2003
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PCN# L0203-10R2 Fab 2 to Fab4 Transfer Product Change Notice PDF 112 KB Jul 15, 2002
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PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB Jun 11, 2001
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PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB May 10, 2000

Software & Tools

Title Type Format File Size Datesort icon
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QS32X861 Hspice Model Model - HSPICE ZIP 6 KB Mar 25, 2002
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QS32X861 IBIS Model Model - IBIS ZIP 4 KB Mar 25, 2002